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NAND Flash Memory
Die and packaged parts
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Implant
Process step where wafers are bombarded with ions called dopants, creating the positive and negative areas on the wafer.
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Maintenance Corridor
Technicians service and maintain equipment without entering the fabrication bays.
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Wafer Saw
Diamond-edged blade cuts the finished wafer into individual die.
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Photo Area
Fabrication area corridor.
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Inspecting Wafer
Team member visually inspecting a wafer.
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Fab
After the circuitry pattern is etched onto the wafer, excess material is removed.
